About the role

What you’ll do

• Lead package integration and architecture efforts from concept through high-volume production
• Work with cross-functional teams and external assembly partners to develop packaging solutions
• Oversee package layout, signal/power integrity, thermal, design rules, BOM, DFM, reliability, and cost
• Deliver high-density, high-performance interconnect solutions across form factor, thermo-mechanical, reliability, and cost constraints
• Collaborate with internal cross-functional teams and overseas suppliers
• Lead and manage teams while working independently on projects

What you’ll need

• BS and 10+ years of relevant industry experience
• Experience in semiconductor packaging design, process, and technology development
• Understanding of cross-functional packaging areas including Si floor plan, package layout, thermal, mechanical, SI/PI, material, reliability, testing, and FA
• Knowledge of advanced packaging technologies for high-density, high-performance interconnects
• Background in Cellular, Connectivity, and PMU packaging
• Strong problem-solving skills, physics fundamentals, and excellent communication abilities

Original job description