Amazon · Tempe, AZ +2 more · Just now · 0 applicants
NewOn-siteFull-timeSenior
Pay
$154k–$215kListed
Workplace
On-site
Job type
Full-time
Level
Senior
Team: Annapurna Labs · Source: jobright · Posted by joined-scrapper
About the role
Design advanced IC packages for AWS machine learning and data center ASICs, from floor planning through tape-out and manufacturing release, collaborating with SI/PI, thermal, and manufacturing teams to deliver production-ready designs.
What you’ll do
Execute physical design of advanced IC packages from floor planning through tape-out
Collaborate with design, SI/PI, thermal, and manufacturing teams
Deliver production-ready designs meeting performance, density, and reliability targets
Define bump maps, ball maps, and escape routing strategies
Perform physical verification including DRC and connectivity checks
Support package design from concept through manufacturing release
What you’ll need
Bachelor's degree in Electrical Engineering or related field
5+ years of experience in IC package layout and physical design
Experience with package layout tools such as Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, or equivalent
Understanding of advanced packaging technologies: 2.5D/3D-IC, fan-out WLP, RDL, TSV, microbump, or silicon bridge interconnects
Working knowledge of package design rules, DFM constraints, and physical verification methodologies
Good communication skills with the ability to work effectively across design, SI/PI, and manufacturing teams
Original job description
Annapurna Labs, an organization within AWS, designs custom silicon and software that accelerate cloud innovation. Amazon is seeking a Package Layout Design Engineer to execute the physical design of advanced IC packages for machine learning and data center ASICs, from floor planning through tape-out and manufacturing release. The role collaborates with…