Amazon's Center for Quantum Computing seeks a fabrication backend engineer to develop and sustain device packaging processes in a cleanroom, supporting R&D and production. The role requires hands-on experience in dicing, wire bonding, flip chip bonding, and process-data analysis.
What you’ll do
Support production and R&D through device packaging
Develop and sustain backend fabrication processes
Troubleshoot equipment and improve infrastructure
Analyze process data and support process improvements
What you’ll need
Bachelor's degree or above in mechanical engineering, electrical engineering, material science, physics or equivalent
2+ years hands-on experience in dicing, wire bonding, or flip chip bonding
2+ years experience with wafer-level and die-level processing in a cleanroom
Experience with process development, statistical process control, and failure analysis
Experience analyzing experimental and observational data sets
Eligibility under U.S. export control regulations (citizen, permanent resident, refugee/asylum, or export license)
Original job description
Amazon Development Center U.S., Inc. is hiring a Fabrication Backend Engineer for its Center for Quantum Computing. The role supports production and R&D through device packaging, backend process development and sustainment, equipment troubleshooting, infrastructure improvements, and process-data analysis.We are looking to hire a hardware development…