Quantum IC Package Substrate Design Engineer at Intel · Hillsboro, OR · Joined
I
Quantum IC Package Substrate Design Engineer
Intel · Hillsboro, OR · Just now · 0 applicants
NewOn-siteFull-timeSenior
Pay
$122k–$173kListed
Workplace
On-site
Job type
Full-time
Level
Senior
Team: Quantum Computing Group · Source: jobright · Posted by joined-scrapper
About the role
This role focuses on designing and validating large form factor IC substrates for Intel's quantum processors, integrating advanced 2.5D/3D packaging and supporting tapeout for scalable quantum systems.
What you’ll do
Design and validate large form factor IC substrates
Integrate advanced 2.5D and 3D packaging
Collaborate with multidisciplinary stakeholders
Support substrate design tapeout for scalable quantum systems
What you’ll need
B.S. in EE/CE or related with 5+ years IC substrate design experience, or M.S. with 3+ years
Experience with Siemens Xpedition design environment and workflow
Experience with high-speed signal routing and large form factor IC substrates
1+ years with advanced routing engines for IC substrate design
Understanding of SI/PI/thermal impact on IC substrate design choices
Excellent communication, analytical, collaborative, and adaptable skills
Original job description
Intel Corporation is a semiconductor company developing silicon-based quantum processors through its Quantum Computing Group. The Quantum IC Package Substrate Design Engineer will design and validate large form factor IC substrates, integrate advanced 2.5D and 3D packaging, collaborate with multidisciplinary stakeholders, and support substrate design…